The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging

Chien-Lung Liang*, Min-Yan Tsai, Yung-Sheng Lin, I-Ting Lin, Sheng-Wen Yang, 

Min-Lung Huang, Jen-Kuang Fang, Kwang-Lung Lin

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (2021) 327-333

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Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu

Ting-Chun Lin, Chien-Lung Liang*, Shan-Bo Wang, Yung-Sheng Lin, Chin-Li Kao, David Tarng,

Kwang-Lung Lin

Scripta Materialia 197 (2021) 113782

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Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment

Pu-Hsin Ku, Chien-Lung Liang*, Kwang-Lung Lin

Materials Characterization 174 (2021) 110980

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Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Chien-Lung Liang*, Yung-Sheng Lin, Chin-Li Kao, David Tarng, Shan-Bo Wang, Yun-Ching Hung, 

Gao-Tian Lin, Kwang-Lung Lin

Materials Chemistry and Physics 256 (2020) 123680

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Investigations of high-temperature tensile properties of Zn–25Sn–x(0.1–0.2)Cu–y(0.01–0.02)Ti high-temperature Pb-free solders

Jeng-Chi Lin, Chien-Lung Liang*, Kwang-Lung Lin 

Journal of Materials Science: Materials in Electronics 31 (2020) 19318–19331

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Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines

Chien-Lung Liang*, Yung-Sheng Lin, Chin-Li Kao, David Tarng, Shan-Bo Wang, Yun-Ching Hung, Gao-Tian Lin, Kwang-Lung Lin

 IEEE Transactions on Components, Packaging and Manufacturing Technology 10 (2020) 1438-1445

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Sn/SnO hybrid graphene for thermal interface material and interconnections with Sn hybrid carbon nanotubes

Jagjiwan Mittal*, Kwang Lung Lin

Materials Science and Engineering: B 253 (2020) 114485

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A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure,

and electrical property

Yi-Han Liao, Chang-Hsien Chen, Chien-Lung Liang*, Kwang-LungLin, Albert T.Wu

Acta Materialia 200 (2020) 200-210

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Electro-work hardening of metals induced by the athermal electromigration effect

Chih-Chi Shu, Chien-Lung Liang*, Kwang-Lung Lin

Materials Science and Engineering: A  772 (2020) 138689

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Joint effects of Ti and Cu additions on microstructure and mechanical properties of

Zn-25Sn-xCu-yTi high-temperature Pb-free solders

Jeng-Chi Lin, Chien-Lung Liang*, Kwang-Lung Lin

Materials Science and Engineering: A 765 (2019) 138323

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The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu

(x = 0–1.0 wt%) high temperature Pb-free solders

Wei-Ting Guo, Chien-Lung Liang*, Kwang-Lung Lin

Materials Science and Engineering: A 750 (2019) 117-124

 

Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration

Chien-Lung Liang*, Kwang-Lung Lin

Journal of Alloys and Compounds 789 (2019) 336-344

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The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate

​Che-Wei Chang*,  Kwang-Lung Lin 

Journal of Materials Science: Materials in Electronics 30 (2019) 13090–13098

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High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Che-Wei Chang*, Kwang-Lung Lin

JOURNAL OF ELECTRONIC MATERIALS 48 (2019) 135

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Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys

Darwin Sarwono*,Kwang-Lung Lin

JOURNAL OF ELECTRONIC MATERIALS 48 (2019) 99

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Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration

Chien-Lung Liang*, Kwang-Lung Lin

MATERIALS LETTERS 236 (2019) 607

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Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Che-Wei Chang*, Kwang-Lung Lin

JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS 29 (2018) 10962

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Crystal Structure Variations of Sn Nanoparticles upon Heating

Jagjiwan Mittal , Kwang-Lung Lin*

JOURNAL OF ELECTRONIC MATERIALS 47 (2018) 2394

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Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

Jagjiwan Mittal , Kwang-Lung Lin

SOLDERING & SURFACE MOUNT TECHNOLOGY 30 (2018) 137

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Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced bycurrent stressing

Chen-Yi Lin , Tsung-Chieh Chiu , Kwang-Lung Lin​​​

JOURNAL OF APPLIED PHYSICS 123 (2018) 115102

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The interfacial bilayer Cu6Sn5 formed in a Sn–Ag–Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging

Chien-Lung Liang*​​, Kwang-Lung Lin​​​ , Po-Jen Cheng

JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS 29 (2018) 15233 

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The microstructure and property variations of metals induced by electric current treatment: A review

Chien-Lung Liang, Kwang-Lung Lin*

MATERIALS CHARACTERIZATION 145 (2018) 545

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The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration

Chien-Lung Liang*, Kwang-Lung Lin

SCRIPTA MATERIALIA 155 (2018) 58

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Softening of Micro Sn Electrodeposit by Polyethylene Glycol (PEG)

Addition

 Tsung-Chieh Chiu* , Ying-Ta Chiu , Kwang-Lung Lin

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 7 (2018) 109

Non-deformation recrystallization of metal with electric current stressing

PinChu Liang, Kwang-Lung Lin*

JOURNAL OF ALLOYS AND COMPOUNDS 722 (2017) 690

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The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions

Chien-Lung Liang*, Kwang-Lung Lin, Po-Jen Cheng

JOURNAL OF MATERIALS SCIENCE 52 (2017) 11659

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The mechanism of an increase in electrical resistance in Al thin film induced by current stressing

Chien-Lung Liang*, Ssu-Wei Lee, Kwang-Lung Lin

THIN SOLID FILMS 636 (2017) 164

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Current induced rapid phase transformation in Au/Sn reaction couple

Tsung-Chieh Chiu*, Kwang-Lung Lin

JOURNAL OF ALLOYS AND COMPOUNDS 712 (2017) 111

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Effect of Au/Pd bilayer metallization on solder/Cu interfacial reaction and growth kinetics of Cu-Sn intermetallic compounds during solid-state aging

Chien-Lung Liang*, Kwang-Lung Lin, Po-Jen Cheng

SURFACE & COATINGS TECHNOLOGY 319 (2017) 55

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Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Chiao-Wen Chen, Tsung-Chieh Chiu*, Ying-Ta Chiu, Chiu-Wen Lee, Kwang-Lung Lin

INTERMETALLICS 85 (2017) 117

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Formation of nanojoints between carbon nanotubes and copper nanoparticles

Jagjiwan Mittal, Kwang-Lung Lin*

CARBON LETTERS 21 (2017) 86

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19. Bulk thermal conductivity studies of Sn/SnO coated and filled multiwalled carbon nanotubes for thermal interface material

JagjiwanMittal*, Kwang-Lung Lin

FULLERENES NANOTUBES AND CARBON NANOSTRUCTURES 25 (2017) 301

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Effects of Al, Pr additions on the wettability and interfacial reaction of Zn-25Sn solder on Cu substrate

Xi Niu*, Kwang-Lung Lin

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 28 (2017) 105

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Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

Jagjiwan Mittal*, Kwang-Lung Lin

JOURNAL OF ELECTRONIC MATERIALS 46 (2017) 602

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Carbon nanotube-based interconnections

J. Mittal*, K. L. Lin

JOURNAL OF MATERIALS SCIENCE 52 (2017) 643

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The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Wei-Hsiang Huang*, Kwang-Lung Lin, Yu-Wei Lin, Yun-Kai Cheng

JOURNAL OF ELECTRONIC MATERIALS 45 (2016) 6130

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Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

Wei-Chih Huang*, Kwang-Lung Lin

JOURNAL OF ELECTRONIC MATERIALS 45 (2016) 6137

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The microstructure and mechanical properties of Zn-25Sn-XAl (X=0-0.09 wt%) high temperature lead free solder

Xi Niu*, Kwang-Lung Lin

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 677 (2016) 384

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Disruption of crystalline structure of Sn3.5Ag induced by electric current

Han-Chie Huang, Kwang-Lung Lin*, Albert T. Wu

JOURNAL OF APPLIED PHYSICS 119 (2016) 115102

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The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing 

Yu-Hsiang Hsiao, Kwang-Lung Lin*

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27 (2016) 2201

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Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Chien-Lung Liang*, Kwang-Lung Lin, Jr-Wei Peng

JOURNAL OF ELECTRONIC MATERIALS 45 (2016) 51

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Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent

M. W. Frischa*, Kwang-Lung Lin

JOURNAL OF ELECTRONIC MATERIALS 45 (2016) 79

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The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing

Ting-Hui Wang*, Kwang-Lung Lin

JOURNAL OF ELECTRONIC MATERIALS 45 (2016) 164

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The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder

Chien-Cheng Pan, Yu-Wei Lin, Chien-I Lin, Jagjiwan Mittal, Kwang-Lung Lin*

JOURNAL OF NON-CRYSTALLINE SOLIDS 430 (2015) 38

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High dislocation density of tin induced by electric current

Yi-Han Liao, Chien-Lung Liang, Kwang-Lung Lin*, Albert T. Wu

A1P ADVANCES 5 (2015) 127210

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Electro-dissolution of the Bi second phase in Sn5Bi solder alloy

Tsung-Chieh Chiu*, Ying-Ta Chiu, Kwang-Lung Lin

MATERIALS LETTERS 160 (2015) 309

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Exothermic low temperature sintering of Cu nanoparticles

Jagjiwan Mittal, Kwang-Lung Lin*

MATERIALS CHARACTERIZATION 109 (2015) 19

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Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAI high temperature lead free solders in air and Ar ambient

Xi Niu*, Kwang-Lung Lin

JOURNAL OF ALLOYS AND COMPOUNDS 646 (2015) 852

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The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing

Jian-Yang He, Kwang-Lung Lin*, Albert T. Wu

JOURNAL OF ALLOYS AND COMPOUNDS 619 (2015) 372

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Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15AI-0.1Ga-xCr Pb-Free Solder

Chin-Wei Liu, Kwang-Lung Lin*

JOURNAL OF ELECTRONIC MATERIALS 43 (2014) 4502

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Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-03Ag-0.01A1-0.1Ga solders on a Ni/Cu substrate under IR reflow

J. Mittal*, K. L. Lin

SOLDERING & SURFACE MOUNT TECHNOLOGY 26 (2014) 87

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The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Yu-Wei Lin, Wun-Bin Ke, Ren-You Wang, I-Sheng Wang, Ying-Ta Chiu, Kuo-Chang Lu*, Kwang-Lung Lin, Yi-Shao Lai

SURFACE & COATINGS TECHNOLOGY 231 (2013) 599

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Connecting Carbon Nanotubes Using Sn 

Jagjiwan Mittal, Kwang Lung Lin*

JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 13 (2013) 5590

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Effect of Ag on the Microstructure of Sn-8.5Zn-xAg-0.01AI-0.1Ga Solders Under High-Temperature and High-Humidity Conditions 

T. K. Yeh, K. L. Lin*, U. S. Mohanty*

JOURNAL OF ELECTRONIC MATERIALS 42 (2013) 616

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Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCI Solution 

Udit Surya Mohanty*, Kwang-Lung Lin*

JOURNAL OF ELECTRONIC MATERIALS 42 (2013) 628

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Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress

Wei-Yu Chen, Tsung-Chieh Chiu*, Kwang-Lung Lin, Albert T. Wu, Wei-Luen Jang, Chung-Li Dong, Hsin-Yi Lee

SCRIPTA MATERIALIA 68 (2013) 317

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Electrorecrystallization of Metal Alloy

Ying-Ta Chiu*, Kwang-Lung Lin, Albert T. Wu, Wei-Luen Jang, Chung-Li Dong, Yi-Shao Lai

JOURNAL OF ALLOYS AND COMPOUNDS 549 (2013) 190

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Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow

Yu-Wei Lin*, Kwang-Lung Lin

INTERMETALLICS 32 (2013) 6

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Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates

Yu-Hsiang Hsiao*, Kwang-Lung Lin, Chiu-Wen Lee, Yu-Hsiu Shao, Yi-Shao Lai

JOURNAL OF ELECTRONIC MATERIALS 41 (2012) 3368

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Effect of Ga on the Oxidation Properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa Solders

Nai-Shuo Liu*, Kwang-Lung Lin

OXIDATION OF METALS 78 (2012) 285

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48. The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process

Kwang-Lung Lin*, Yu-Wei Lin, Chang-Ho Yu

JOM 64 (2012) 1184

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Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint

Wei-Yu Chen*, Tsung-Chieh Chiu, Kwang-Lung Lin, Yi-Shao Lai

INTERMETALLICS 26 (2012) 40

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The performance and fracture mechanism of solder joints under mechanical reliability test

Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin*, Yi-Shao Lai

MICROELECTRONICS RELIABILITY 52 (2012) 1428

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The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

Yu-Wei Lin, Ren-You Wang, Wun-Bin Ke, I-Sheng Wang, Ying-Ta Chiu, Kuo-Chang Lu*, Kwang-Lung Lin, Yi-Shao Lai

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 543 (2012) 152

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Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate

Jagjiwan Mittal, Kwang-Lung Lin*

JOURNAL OF MATERIALS RESEARCH 27 (2012) 1142

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The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing

Tsung-Chieh Chiu*, Kwang-Lung Lin

INTERMETALLICS 23 (2012) 208

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Dissolution of Sn in a SnPb solder bump under current stressing

Ying-Ta Chiu*, Kwang-Lung Lin, Yi-Shao Lai

JOURNAL OF APPLIED PHYSICS 111 (2012) 043517

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Carbon nanotube buckypaper/MmNi(5) composite film as anode for Ni/MH batteries

P. J. Tsai, T. C. Chiu, P. H. Tsai, K. L. Lin, K. S. Lin, S. L. I. Chan*

INTERNATIONAL JOURNAL OF HYDROGEN ENERGY 37 (2012) 3491

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A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints

De-Shin Liu, Chang-Lin Hsu*, Chia-Yuan Kuo, Ya-Ling Huang, Kwang-Lung Lin, Geng-Shin Shen

SOLDERING & SURFACE MOUNT TECHNOLOGY 24 (2012) 22