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70320873_867930280274916_801041644575208

陳巍夫

Master

​通電對鈦-6鋁-4釩合金性質及微結構影響之研究

Effects of Electric Current Stressing on Properties and Microstructure of Ti-6Al-4V Alloy

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張昱瑞

Master

通電對鋅錫高溫無鉛銲錫合金微結構與拉伸性質影響之研究

Effects of Current Stressing on Microstructure and Tensile Properties of Zn-25Sn High Temperature Pb-free Solder Alloys

蔣承諭

Master

通電對6061鋁合金性質及微結構影響之研究

Effects of Current Stressing on the Properties and Microstructure of 6061 Aluminum Alloy
 

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張哲偉

Ph.D. candidate

研究領域:高溫銲錫、金屬冶煉、破壞變形

李汶容

Master

通電對英高鎳合金之性質與微結構影響之研究

​Effect of current stressing on properties and microstructure of Inconel 600 alloy

葉鎧熤

Master

​Zn-25Sn-xTi(x=0、0.02)高溫無鉛銲錫接點界面微結構與界面反應之研究

The Interfacial Microstructure and Interfacial reactions of  Zn-25Sn-xTi(x=0、0.02) High Temperature Pb-free Solder Joints

劉季銘

Master

​熱時效對鋅錫高溫無鉛銲錫與銅及鎳界面反應行為之影響

Effects of Thermal Aging on the Interfacial Reaction between Zn-25Sn-xTi Solder and Cu,Ni Substrates

黃俊嘉

Master

通電對因瓦合金微結構與性質影響之研究

​Effects of Current Stressing on Microstructure and Properties of Invar 36 Alloy

邱琮傑

Post doctoral

無鉛錫銀系銲錫與銅、金電極之電遷移行為研究

Investigation of Electromigration Behavior of SnAg Based Solders with Cu and Au Electrodes

齊冠評

Ph.D. candidate

研究領域:氧化物冶金、 元素添加方法、懸浮冶煉、 鎳鈦合金熔煉

吳仰鎧

Ph.D. candidate

Sn-Zn與Sn-Ag-Cu系列無鉛銲錫之比熱量測與探討

Investigation of the heat capacity of Sn-Zn and Sn-Ag-Cu lead-free solders

吳詩良

Master

鋅錫鈦無鉛銲錫多重迴焊過程的界面反應行為之研究

Interfacial Reaction between Zn-25Sn-xTi Pb-free Solder Alloys and Cu Substrate under Multiple Reflow

林政錡

Master

鋅錫銅鈦高溫無鉛銲錫合金微結構與拉伸性質之研究

The Microstructure and Tensile Properties of Zn-25Sn-xCu-yTi High Temperature Pb-free Solder Alloys

蔡文傑

Master

銀合金線材電化學離子遷移行為與衍生之奈米樹枝狀結晶探討

The electrochemical ion migration behavior and the afterwards formation of dendritic nanostructures of silver alloy wire

王煜

Master

通電對1050鋁合金機械性質與微結構的影響之研究

Effects of Current Stressing on Microstructure and Mechanical Properties of 1050 Aluminum.

黃偉誌

Master

鋅錫鈦高溫無鉛銲錫氧化及介面潤濕反應行為之研究

​The Oxidation and Wetting Behavior of Zn-25Sn-xTi High Temperature Pb-free Solder Alloy

黃蔚翔

Master

Ag-xPd 合金線與鋁打線接合經不同測試環境介面反應探討

​The interfacial reaction of Ag-xPd wire bonding on Al pad under various testing conditions 

梁品筑

Master

銅鋅合金電致再結晶之晶粒細化行為研究

The grain refining behavior induced by current-induced recrystallization on Cu-Zn alloy

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孟友琪

Master

通電對純錫之微結構與性質影響之機制

The Mechanism of Microstructure and Properties Variation of Sn under Current Stressing

陳民仁

Master

鋅錫銅鈦高溫無鉛銲錫接點微結構與剪力性質之研究

The Microstructure and Shear Properties of Zn-25Sn-xCu-yTi High Temperature Pb-free Solder Joints

周韋民

Master

通電對銅鋅合金電性及機械性質與微結構影響之研究

Effects of current stressing on microstructure and properties of Cu36Zn alloy

林立德

Master

研究領域:高溫銲錫

牛禧

Ph.D

​添加 Al, Pr 對 Zn-25Sn 高溫無鉛銲錫的介面潤濕、氧化及機械性質的影響

Effects of the Al, Pr Additions on the Wetting, Oxidation and Mechanical Properties of Zn-25Sn High Temperature Pb-free Solder Alloys

郭威廷

Master

鋅錫銅高溫無鉛銲錫合金微結構與拉伸性質之研究

​The Microstructure and Tensile Properties of Zn-25Sn-xCu High Temperature PB-free Solder Alloys

黃振訓

Master

多層石墨烯間附著錫/二氧化錫之合成與性質研究

​Synthesis and Properties of Multilayer Graphene Coated with Sn/SnO2

蘇美甄

Master

通電對銀鈀金線微結構及機械性質的影響之研究

​Effect of Current Stressing on Microstructure and Mechanical Properties of Ag-Pd-In Alloy Wire

葉哲瑋

Master

鋅錫銅高溫無鉛銲錫介面潤濕反應及氧化行為之研究

Wetting and Oxidation Behavior Zn-25Sn-xCu High Temperature Pb-free Solder Alloys

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